AD524
OUTLINE DIMENSIONS
0.005 (0.13) MIN 0.080 (2.03) MAX
PIN 1
0.200 (5.08)
MAX
16
9
1
8
0.840 (21.34) MAX
0.310 (7.87)
0.220 (5.59)
0.060 (1.52)
0.015 (0.38)
0.320 (8.13)
0.290 (7.37)
0.200 (5.08)
0.125 (3.18)
0.023 (0.58)
0.014 (0.36)
0.150
(3.81)
MIN
0.100 0.070 (1.78) SEATING
(2.54)
BSC
0.030 (0.76)
PLANE
0.015 (0.38)
0.008 (0.20)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 55. 16-Lead Side-Brazed Ceramic Dual In-Line [SBDIP]
(D-16)
Dimensions shown in inches and (millimeters)
0.100 (2.54)
0.064 (1.63)
0.358 (9.09)
0.342 (8.69)
SQ
0.358
(9.09)
MAX
SQ
0.088 (2.24)
0.054 (1.37)
0.075 (1.91)
REF
0.095 (2.41)
0.075 (1.90)
0.011 (0.28)
0.007 (0.18)
R TYP
0.075 (1.91)
REF
0.055 (1.40)
0.045 (1.14)
0.200 (5.08)
REF
0.100 (2.54) REF
19
3
18 20
4
1
BOTTOM
VIEW
14
8
13
9
0.015 (0.38)
MIN
0.028 (0.71)
0.022 (0.56)
0.050 (1.27)
BSC
45° TYP
0.150 (3.81)
BSC
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 56. 20-Terminal Ceramic Leadless Chip Carrier [LCC]
(E-20)
Dimensions shown in inches and (millimeters)
10.50 (0.4134)
10.10 (0.3976)
16
9
7.60 (0.2992)
7.40 (0.2913)
1
8
10.65 (0.4193)
10.00 (0.3937)
0.30 (0.0118)
0.10 (0.0039)
COPLANARITY
0.10
1.27 (0.0500)
BSC
0.51 (0.0201)
0.31 (0.0122)
2.65 (0.1043)
2.35 (0.0925)
8°
0°
SEATING
PLANE
0.33 (0.0130)
0.20 (0.0079)
0.75 (0.0295)
0.25 (0.0098) 45°
1.27 (0.0500)
0.40 (0.0157)
COMPLIANT TO JEDEC STANDARDS MS-013- AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 57. 16-Lead Standard Small Outline Package [SOIC_W]
Wide Body (RW-16)
Dimensions shown in millimeters and (inches)
Rev. F | Page 24 of 28