AD7492ARUZ-REEL 查看數據表（PDF） - Analog Devices
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AD7492ARUZ-REEL Datasheet PDF : 24 Pages
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OUTLINE DIMENSIONS
15.60 (0.6142)
15.20 (0.5984)
24
1
13
7.60 (0.2992)
7.40 (0.2913)
10.65 (0.4193)
12
10.00 (0.3937)
0.30 (0.0118)
0.10 (0.0039)
COPLANARITY 1.27 (0.0500)
0.10
BSC
2.65 (0.1043)
2.35 (0.0925)
0.75 (0.0295) × 45°
0.25 (0.0098)
0.51 (0.020)
0.31 (0.012)
8°
SEATING
PLANE
0.33 (0.0130)
0°
0.20 (0.0079)
1.27 (0.0500)
0.40 (0.0157)
COMPLIANT TO JEDEC STANDARDS MS-013-AD
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 34. 24-Lead Standard Small Outline Package [SOIC_W]
Wide Body
(RW-24)
Dimensions shown in millimeters and (inches)
7.90
7.80
7.70
ORDERING GUIDE
Model
AD7492AR
AD7492AR–REEL
AD7492AR–REEL7
AD7492ARZ1
AD7492ARZ–REEL1
AD7492ARZ–REEL71
AD7492BR
AD7492BR-REEL
AD7492BR–REEL7
AD7492BRZ1
AD7492AR-5
AD7492AR-5–REEL
24
13
4.50
4.40
4.30
6.40 BSC
1
12
PIN 1
0.65
1.20
BSC
MAX
0.15
0.05
8°
0.75
0.30
0.19
SEATING 0.20
0°
0.60
PLANE
0.09
0.45
0.10 COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-153-AD
Figure 35. 24-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-24)
Dimensions shown in millimeters
Temperature
Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Resolution (Bits)
12
12
12
12
12
12
12
12
12
12
12
12
Throughput Rate
(MSPS)
1
1
1
1
1
1
1
1
1
1
1.25
1.25
Rev. A | Page 21 of 24
Package
Description
24-Lead SOIC_W
24-Lead SOIC_W
24-Lead SOIC_W
24-Lead SOIC_W
24-Lead SOIC_W
24-Lead SOIC_W
24-Lead SOIC_W
24-Lead SOIC_W
24-Lead SOIC_W
24-Lead SOIC_W
24-Lead SOIC_W
24-Lead SOIC_W
AD7492
Package Option
RW-24
RW-24
RW-24
RW-24
RW-24
RW-24
RW-24
RW-24
RW-24
RW-24
RW-24
RW-24
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