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AD8335 查看數據表(PDF) - Analog Devices

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AD8335 Datasheet PDF : 24 Pages
First Prev 21 22 23 24
AD8335
OUTLINE DIMENSIONS
9.00
BSC SQ
PIN 1
INDICATOR
TOP
VIEW
0.60 MAX
0.60 MAX
49
48
0.30
0.25
0.18
64
1
PIN 1
INDICATOR
8.75
BSC SQ
EXPOSED PAD
(BOTTOM VIEW)
4.85
4.70 SQ*
4.55
1.00 12° MAX
0.85
0.80
SEATING
PLANE
0.45
0.40
33
16
0.35
32
17
0.80 MAX
0.65 TYP
0.50 BSC
0.05 MAX
0.02 NOM
0.20 REF
7.50
REF
*COMPLIANT TO JEDEC STANDARDS MO-220-VMMD
EXCEPT FOR EXPOSED PAD DIMENSION
Figure 60. 64-Lead Lead Frame Chip Scale Package [LFCSP]
(CP-64)
Dimensions shown in millimeters
ORDERING GUIDE
Model
AD8335ACPZ1
AD8335ACPZ-REEL1
AD8335ACPZ-REEL71
AD8335-EVAL
1 Z = Pb-free part.
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Evaluation Board with AD8335ACP
Package Option
CP-64
CP-64
CP-64
© 2004 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D04976–0–9/04(0)
Rev. 0 | Page 24 of 24

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