AD9286(Rev0) 查看數據表（PDF） - Analog Devices
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AD9286 Datasheet PDF : 28 Pages
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ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Electrical
AVDD to AGND
DRVDD to DRGND
AGND to DRGND
AVDD to DRVDD
D0+/D0− through D7+/D7−
to DRGND
DCO+, DCO− to DRGND
CLK+, CLK− to AGND
AUXCLK+, AUXCLK− to AGND
VIN1±, VIN2± to AGND
SDIO/PWDN to DRGND
CSB to AGND
SCLK to AGND
Environmental
Storage Temperature Range
Operating Temperature Range
Lead Temperature
(Soldering, 10 sec)
Junction Temperature
Rating
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +0.3 V
−2.0 V to +2.0 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−65°C to +125°C
−40°C to +85°C
300°C
150°C
AD9286
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 7. Thermal Resistance
Package Type
θJA
θJC
48-Lead LFCSP (CP-48-12)
30.4
2.9
Unit
°C/W
ESD CAUTION
Rev. 0 | Page 9 of 28
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