ADG1433 查看數據表（PDF） - Analog Devices
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ADG1433 Datasheet PDF : 20 Pages
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Data Sheet
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameter
VDD to VSS
VDD to GND
VSS to GND
Analog Inputs1
Digital Inputs1
Peak Current, S or D (Pulsed at 1 ms,
10% Duty Cycle Maximum)
Continuous Current, S or D2
Operating Temperature Range
Industrial (Y Version)
Storage Temperature Range
Junction Temperature
Reflow Soldering Peak
Temperature (Pb-Free)
Rating
35 V
−0.3 V to +25 V
−25 V to +0.3 V
VSS − 0.3 V to VDD + 0.3 V or
30 mA (whichever occurs first)
GND − 0.3 V to VDD + 0.3 V or
30 mA (whichever occurs first)
250 mA
Data + 15%
−40°C to +125°C
−65°C to +150°C
150°C
260 (+ 0 to −5)°C
1 Overvoltages at A, EN, S, or D pins are clamped by internal diodes. Current
must be limited to the maximum ratings given.
2 See data given in the Specifications section (see Table 1 to Table 3).
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Only one absolute maximum rating may be applied at any
one time.
ADG1433/ADG1434
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 5.
Package Type
TSSOP
LFCSP
θJA
150.4
30.4
θJC
50
N/A1
Unit
°C/W
°C/W
1 N/A means not applicable.
ESD CAUTION
Rev. E | Page 7 of 20
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