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ADG1439 查看數據表(PDF) - Analog Devices

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ADG1439 Datasheet PDF : 20 Pages
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ADG1438/ADG1439
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 8.
Parameter
VDD to VSS
VDD to GND
VSS to GND
VL to GND
Analog Inputs1
Digital Inputs1
Continuous Current, Sx or
Dx Pins
Peak Current, Sx or Dx Pins
(Pulsed at 1 ms, 10% Duty
Cycle Max)
TSSOP
LFCSP
Operating Temperature Range
Industrial (B Version)
Storage Temperature Range
Junction Temperature
Reflow Soldering Peak
Temperature (Pb-Free)
Time at Peak Temperature
Rating
35 V
−0.3 V to +25 V
+0.3 V to −25 V
−0.3 V to +7 V
VSS − 0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
GND − 0.3 V to VL + 0.3 V or
30 mA, whichever occurs first
Table 5 and Table 6 specifica-
tions + 15%
300 mA
400 mA
−40°C to +125°C
−65°C to +150°C
150°C
260(+0/−5)°C
10 sec to 40 sec
1 Overvoltages at the analog and digital inputs are clamped by internal
diodes. Current should be limited to the maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating can be applied at any one time.
THERMAL RESISTANCE
Table 9. Thermal Resistance
Package Type
20 Lead TSSOP (4-Layer Board)
20-Lead LFCSP (4-Layer Board and
Exposed Paddle Soldered to VSS)
θJA
θJC
112.6 50
30.4 N/A
Unit
°C/W
°C/W
ESD CAUTION
Rev. 0 | Page 10 of 20

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