ADG658YRU(RevA) 查看數據表（PDF） - Analog Devices

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ADG658YRU
(Rev.:RevA)

+3 V/+5 V/±5 V CMOS 4- and 8-Channel Analog Multiplexers

Analog Devices 

ADG658/ADG659

ORDERING GUIDE

Model

ADG658YRU

ADG658YRU-REEL7

ADG658YCP

ADG658YCP-REEL7

ADG658YRQ

ADG658YRQ-REEL

ADG658YRQ-REEL7

ADG659YRU

ADG659YRU-REEL7

ADG659YCP

ADG659YCP-REEL7

ADG659YCPZ1

ADG659YCPZ-REEL71

ADG659YRQ

ADG659YRQ-REEL

ADG659YRQ-REEL7

1 Z = Pb-free part.

0.193

BSC

16

9

0.154

BSC

0.236

1

8

BSC

0.065

0.049

PIN 1

0.069

0.053

0.010

0.004

COPLANARITY

0.004

0.025

BSC

0.012

0.008

SEATING

PLANE

8°

0°

0.010

0.006

COMPLIANT TO JEDEC STANDARDS MO-137AB

Figure 34. 16-Lead Shrink Small Outline Package [QSOP]

(RQ-16)

Dimensions shown in millimeters

0.050

0.016

Temperature Range

−40°C to +125°C

−40°C to +125°C

−40°C to +85°C

−40°C to +85°C

−40°C to +125°C

−40°C to +125°C

−40°C to +125°C

−40°C to +125°C

−40°C to +125°C

−40°C to +85°C

−40°C to +85°C

−40°C to +85°C

−40°C to +85°C

−40°C to +125°C

−40°C to +125°C

−40°C to +125°C

Package Description

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Lead Frame Chip Scale Package (LFCSP)

Lead Frame Chip Scale Package (LFCSP)

Shrink Small Outline Package (QSOP)

Shrink Small Outline Package (QSOP)

Shrink Small Outline Package (QSOP)

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Lead Frame Chip Scale Package (LFCSP)

Lead Frame Chip Scale Package (LFCSP)

Lead Frame Chip Scale Package (LFCSP)

Lead Frame Chip Scale Package (LFCSP)

Shrink Small Outline Package (QSOP)

Shrink Small Outline Package (QSOP)

Shrink Small Outline Package (QSOP)

Package Option

RU-16

RU-16

CP-16

CP-16

RQ-16

RQ-16

RQ-16

RU-16

RU-16

CP-16

CP-16

CP-16

CP-16

RQ-16

RQ-16

RQ-16

© 2004 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

C03273-0-7/04(A)

Rev. A | Page 20 of 20

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