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ADN2817ACPZ-RL7(RevG) 查看數據表(PDF) - Analog Devices

零件编号
产品描述 (功能)
生产厂家
ADN2817ACPZ-RL7
(Rev.:RevG)
ADI
Analog Devices ADI
ADN2817ACPZ-RL7 Datasheet PDF : 38 Pages
First Prev 31 32 33 34 35 36 37 38
ADN2817/ADN2818
OUTLINE DIMENSIONS
PIN 1
INDICATOR
AREA
0.80
0.75
0.70
SEATING
PLANE
5.10
5.00 SQ
4.90
TOP VIEW
SIDE VIEW
0.50
BSC
0.30
0.25
0.18
25
24
DETAIL A
(JEDEC 95)
32
1
PIN 1
IN D IC ATO R AR E A OP T IO N S
(SEE DETAIL A)
EXPOSED
PAD
3.65
3.50 SQ
3.45
0.50
0.40
0.30
17
16
BOTTOM VIEW
3.50 REF
8
9
0.20 MIN
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WHHD
Figure 43. 32-Lead Lead Frame Chip Scale Package [LFCSP]
5 mm × 5 mm Body and 0.75 mm Package Height
(CP-32-11)
Dimensions shown in millimeters
Data Sheet
ORDERING GUIDE
Model1
ADN2817ACPZ
ADN2817ACPZ-RL
ADN2817ACPZ-RL7
ADN2818ACPZ
ADN2818ACPZ-RL
ADN2818ACPZ-RL7
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
1 Z = RoHS Compliant Part.
Package Description
32-Lead LFCSP
32-Lead LFCSP, 13” Tape and Reel
32-Lead LFCSP, 7” Tape and Reel
32-Lead LFCSP
32-Lead LFCSP, 13” Tape and Reel
32-Lead LFCSP, 7” Tape and Reel
Package Option
CP-32-11
CP-32-11
CP-32-11
CP-32-11
CP-32-11
CP-32-11
Ordering Quantity
490
5,000
1,500
490
5,000
1,500
I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
©2007–2019 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D06001-0-6/19(G)
Rev. G | Page 38 of 38

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