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ADN2860 查看數據表(PDF) - Analog Devices

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ADN2860 Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
ADN2860
OUTLINE DIMENSIONS
4.00
BSC SQ
0.60 MAX
PIN 1
INDICATOR
TOP
VIEW
3.75
BSC SQ
1.00 12° MAX
0.85
0.80
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
0.50
BSC
0.50
0.40
0.30
0.60 MAX
PIN 1
INDICATOR
19
24 1
18
EXPOSED
PAD
(BOTTOM VIEW)
13
12
6
7
2.25
2.10 SQ
1.95
0.25 MIN
2.50 REF
SEATING
PLANE
0.30
COPLANARITY
0.23 0.20 REF
0.08
0.18
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-2
Figure 34. 24-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body
(CP-24-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
ADN2860ACPZ25-RL71
ADN2860ACPZ250-RL71
ADN2860-EVAL
Temperature
Range
−40°C to +85°C
−40°C to +85°C
Package Description
Lead Frame Chip Scale Package
Lead Frame Chip Scale Package
Evaluation Board
Package Option
CP-24-1
CP-24-1
Full Container
Quantity
1,500
1,500
RAB (kΩ)
25
250
1 Z = Pb-free part.
© 2004 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D03615-0-11/04(A)
Rev. A | Page 20 of 20

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