ADR293GR-REEL7 查看數據表（PDF） - Analog Devices
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ADR293GR-REEL7 Datasheet PDF : 12 Pages
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ADR293
OUTLINE DIMENSIONS
5.00 (0.1968)
4.80 (0.1890)
8
4.00 (0.1574)
3.80 (0.1497) 1
5
6.20 (0.2441)
4 5.80 (0.2284)
0.25 (0.0098)
0.10 (0.0040)
1.27 (0.0500)
BSC
1.75 (0.0688)
1.35 (0.0532)
COPLANARITY
0.10
SEATING
PLANE
0.51 (0.0201)
0.31 (0.0122)
0.50 (0.0196) 45°
0.25 (0.0099)
8°
0°
1.27 (0.0500)
0.25 (0.0098) 0.40 (0.0157)
0.17 (0.0067)
COMPLIANT TO JEDEC STANDARDS MS-012-AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 25. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-8)
Dimensions shown in millimeters and (inches)
3.10
3.00
2.90
ORDERING GUIDE
Model1
ADR293ERZ
ADR293ERZ-REEL
ADR293GRZ
ADR293GRZ-REEL7
ADR293GRUZ
ADR293GRUZ-REEL
ADR293GRUZ-REEL7
Output
Voltage (V)
5.00
5.00
5.00
5.00
5.00
5.00
5.00
8
5
4.50
4.40 6.40 BSC
4.30
1
4
PIN 1
0.65 BSC
0.15
0.05
1.20
MAX
8°
COPLANARITY 0.30 SEATING 0.20
0°
0.10
0.19 PLANE 0.09
0.75
0.60
0.45
COMPLIANT TO JEDEC STANDARDS MO-153-AA
Figure 26. 8-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-8)
Dimensions shown in millimeters
Initial
Accuracy (%)
0.06
0.06
0.20
0.20
0.20
0.20
0.20
Temperature
Coefficient
(ppm/°C max)
8
8
25
25
25
25
25
Temperature
Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Package
Description
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead TSSOP
8-Lead TSSOP
8-Lead TSSOP
1 Z = RoHS Compliant Part.
Package
Option
R-8
R-8
R-8
R-8
RU-8
RU-8
RU-8
Ordering
Quantity
98
2,500
98
1,000
96
2,500
1,000
©2001-2011 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D00164-0-5/11(D)
Rev. D | Page 12 of 12
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