GS8180D18D-133I 查看數據表（PDF） - Giga Semiconductor
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GS8180D18D-133I Datasheet PDF : 28 Pages
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GS8180D18D-250/200/167/133/100
Package Dimensions—165-Bump FPBGA (Package D; Variation 3)
A1 CORNER
TOP VIEW
1 2 3 4 5 6 7 8 9 10 11
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
C
SEATING PLANE
Ø0.10 M C
BOTTOM VIEW
Ø0.25 M C A B
A1 CORNER
Ø0.44~0.64 (165x)
11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
A
1.0
1.0
10.0
B
0.20(4x)
13±0.05
Rev: 2.04 4/2005
27/28
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2002, GSI Technology
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