UPD3794 查看數據表（PDF） - NEC => Renesas Technology
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UPD3794 Datasheet PDF : 20 Pages
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µPD3794
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below.
If other soldering processes are used, or if the soldering is performed under different conditions, please make sure
to consult with our sales offices.
For more details, refer to our document "Semiconductor Device Mounting Technology Manual"(C10535E).
Type of Through-hole Device
µPD3794CY: CCD linear image sensor 22-pin plastic DIP (400 mil)
Process
Partial heating method
Conditions
Pin temperature: 260 °C or below,
Heat Time: 10 seconds or less (per pin)
Caution During assembly care should be taken to prevent solder or flux from contacting the plastic cap.
The optical characteristics could be degraded by such contact.
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