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AS2702-16 查看數據表(PDF) - austriamicrosystems AG

零件编号
产品描述 (功能)
生产厂家
AS2702-16
AmsAG
austriamicrosystems AG AmsAG
AS2702-16 Datasheet PDF : 13 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
AS2702 – AS-Interface Slave IC
SOIC 20 SOIC 16 Name
14
12
PFAULT
15
13
LED2
16
14
PSTBn
17
15
D3
18
16
D2
19
-
P3
20
-
P2
Type
I, digital, pull-up
Note
1
I/O, digital, pull-up 1
I/O, digital, pull-up 1
I/O, digital
I/O, digital
I/O, digital, pull-up 1, 2
I/O, digital, pull-up 1, 2
Description
Low-active input to flag failure of the sensors/actuators circuitry
connected
LED output 2 (IC test input)
Parameter port strobe output (IC test input)
Bidir. data port bit 3
Bidir. data port bit 2
Bidir. parameter port bit 3
Bidir. parameter port bit 2
Notes:
1 The pull-up structure is a passive high-side current source with a nom. 10µA current.
2 The passive pull-up current source as per note 1 on these parameter port pins is off, if the slave device is programmed with
I/O-configuration code 7 and a master data call is present.
Functional, Electrical and Timing Characteristics
All voltages are referenced to ground pin LTGN. Timing is valid for a quartz crystal frequency of 5.333MHz.
Absolute Maximum Ratings
Symbol
VLTGP
VCDC
VU5R
IIN
ESD1
ESD2
Tstg
Tbody
Ptot
RTHJA
RTHJA
Parameter
Voltage at the positive supply pin
Voltage at pin for ext. buffer capacitor
Voltage at pins U5R, OSC1, OSC2
Input current at any pin, except for LTGP, CDC
Electrostatic discharge voltage
Electrostatic discharge voltage
Storage temperature
Soldering conditions
Max. power dissipation
Thermal resistance SOIC 16
Thermal resistance SOIC 20
Min
-0.3
-0.3
-0.3
-50
1500
300
-55
61.2
58.5
Max
40
VLTGP + 0.3V
7
50
125
260
1
74.8
71.5
Unit
V
V
V
mA
V
V
V
°C
W
°K/W
°K/W
Note
1)
2)
3)
4)
5)
6)
7)
7)
Notes:
1) 50V during t > 50µs; repetition rate < 0.5Hz
2) Latch-up immunity test. Please observe max. power dissipation allowed
3) Human body model: R = 1.5kOhm; C = 100pF
4) Machine model; applies only for LTGP
5) The reflow peak soldering temperature (body temperature) is specified according IPC/JEDEC J-STD-020C.
6) Free convection, see Figure 2
7) No forced cooling. PCB-surface: 21 cm2; still air volume around the device. 10 cm3
Revision 1.3, 21-Aug-08
Page 3 of 13

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