AT24C04B-PU 查看數據表（PDF） - Atmel Corporation
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AT24C04B-PU Datasheet PDF : 28 Pages
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8U3-1 – Dbga2
Figure 20. 8U3-1 – Dbga2
E
D
1. b
PIN 1 BALL PAD CORNER
Top View
(d1)
PIN 1 BALL PAD CORNER
1
2
3
4
d
A1
A2
A
Side View
8
7
e
6
5
(e1)
Bottom Vi ew
8 SOLDER BALLS
1. Dimension “b” is measured at the maxmi um solder ball diameter.
This drawing is for general information only.
SYMBOL
A
A1
A2
b
D
E
e
e1
d
d1
COMMON DIMENSIONS
(Unit of Measure = mm)
MIN
0.71
0.10
0.40
0.20
NOM MAX
0.81
0.91
0.15
0.20
0.45
0.50
0.25
0.30
1.50 BSC
2.00 BSC
0.50 BSC
0.25 REF
1.00 BSC
0.25 REF
NOTE
TITLE
1150 E. Cheyenne Mtn. Blvd. 8U3-1, 8-ball, 1.50 x 2.00 mm Body, 0.50 mm pitch,
R Colorado Springs, CO 80906 Small Die Ball Grid Array Package (dBGA2)
6/24/03
DRAWING NO. REV.
PO8U3-1
A
26 AT24C04B/08B
5226G–SEEPR–11/09
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