NX25F641C 查看數據表（PDF） - NexFlash -> Winbond Electronics

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NX25F641C

64M-BIT SERIAL FLASH MEMORY WITH 4-PIN SPI INTERFACE

NexFlash -> Winbond Electronics 

NX25F641C

Plastic TSOP - 32-pins

Package Code: T (Type I)

1

EH

N

D

SEATING PLANE

S

A

e

B

A1

L

α

C

Plastic TSOP (T—Type I)

Millimeters

Inches

Symbol Min Max

Min Max

Ref. Std.

No. Leads

32

A

– 1.20

– 0.047

A1

0.05 0.15

0.002 0.005

B

0.17 0.27

0.007 0.009

C

0.10 0.21

0.004 0.008

D

7.90 8.10

0.308 0.316

E

18.30 18.50

0.714 0.722

H

19.80 20.20

0.772 0.788

e

0.50 BSC

0.020 BSC

L

0.50 0.70

0.016 0.024

a

0° 5°

0°

5°

Notes:

1. Controlling dimension: millimeters, unless

otherwise specified.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E do not include mold

flash protrusions and should be measured

from the bottom of the package.

4. Formed leads shall be planar with respect to

one another within 0.004 inches at the

seating plane.

22

NexFlash Technologies, Inc.

PRELIMINARY NXSF032A-0502

05/06/02 ©

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