BA4510FVM 查看數據表（PDF） - ROHM Semiconductor
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BA4510FVM Datasheet PDF : 51 Pages
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BA4558F,BA4558R F/FV/FVM,BA4560F,BA4560RF/FV/FVM,BA4564RFVBA4580RF/FVM,BA4584FV,
BA4584RF/FV,BA8522RF/FV/FVM,BA15218F,BA14741F,BA15532F,BA4510F/FV,BA2115F/FVM
Technical Note
●Derating curve
Power dissipation (total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature).IC is heated
when it consumed power, and the temperature of IC ship becomes higher than ambient temperature. The temperature that
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.
Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal
resistance of package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum
value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead frame
of the package. The parameter which indicates this heat dissipation capability (hardness of heat release) is called thermal
resistance, represented by the symbol θj-a[℃/W]. The temperature of IC inside the package can be estimated by this
thermal resistance. Fig.319 (a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient
temperature Ta, junction temperature Tj, and power dissipation Pd can be calculated by the equation below:
θja = (Tj-Ta) / Pd [℃/W]
・・・・・ (Ⅰ)
Derating curve in Fig.319 (b) indicates power that can be consumed by IC with reference to ambient temperature. Power that
can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at
certain ambient temperature. This gradient is determined by thermal resistance θja. Thermal resistance θja depends on chip
size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of
package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Fig.320(c), ～, (f)
show a derating curve for an example of BA4558, BA4558R, BA4560, BA4560R, BA4564R, BA4580R, BA4584, BA4584R,
BA8522R, BA15218, BA14741, BA15532, BA4510, BA2115.
θja = ( Tj ーTa ) / Pd [℃/W]
Power dissipation of LSI [W]
LSIの 消 費 電 力 [W]
Pd (max)
Ambie周nt囲te温m度perTaatu[℃re] Ta [℃]
P2
θja2 < θja1
θ' ja2
P1
θ ja2
CPohwipesruチdrifッsasプciep表atet面iom温np度Pera[WTtuj ][r℃e ]Tj [℃]
消費電力 P [W]
θ' ja1 θ ja1
Tj ' (max) Tj (max)
0
25
50
75
100 125 150
Ambient 周te囲mp温e度ratTuare[℃T]a [℃]
(a) Thermal resistance
(b) Derating curve
Fig. 319 Thermal resistance and derating curve
1000
780mW (*37)
800
690mW (*38)
600 590mW (*39)
BA4558RF
BA4564RF
BA4580RF
BA8522RF
BA4558RFVM
BA4564RFVM
BA4580RFVM
BA8522RFVM
400
BA4558RFV
BA4564RFV
BA8522RFV BA2115FVM
BA2115F
200
1000
870mW (*40)
800
610mW (*41)
600
400
BA4584RF
BA4564RFV
BA4584RFV
200
BA4584FV
0
0
25
50
75
100
125
Ambien周t T囲e温m度perTaatu[℃re]Ta [℃]
(c)BA4558R/BA4560R/BA4580R/BA8522R/BA2115 family
0
0 Am25bie周nt囲te5温0m度perTaat7u5[℃re]Ta 1[℃00 ] 125
(d)BA4564R/BA4584/BA4584R family
1000
1000
800
620mW (*42)
600
550mW (*43)
400
BA4558F
BA4560F
BA15218F
BA4510F
BA15532F
800
600
490mW (*44)
BA14741F
400
BA4510F
200
200
0
0
25
50
75
100
125
Ambien周t t囲em温p度eraTatu[r℃e ]Ta [℃]
(e)BA4558/BA4560/BA15218/BA15532/BA4510 family
0
0
25
50
75
100
125
Ambie周nt囲Te温m度peTraat[u℃re] Ta [℃]
(f)BA14741F
(*37)
(*38)
(*39)
(*40)
(*41)
(*42)
(*43)
6.2
5.5
4.7
7.0
5.3
6.2
5.5
When using the unit above Ta=25[℃], subtract the value above per degree[℃]. Permissible dissipation is the value.
When FR4 glass epoxy board 70[mm]×70[mm]×1.6[mm] (cooper foil area below 3[%]) is mounted.
Fig. 320 Derating curve
(*44)
4.9
Unit
[mW/℃]
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