INA-54063-BLK 查看數據表（PDF） - HP => Agilent Technologies
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INA-54063-BLK Datasheet PDF : 10 Pages
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SOT-363 PCB Layout
The INA-54063 is packaged in the
miniature SOT-363 (SC-70)
surface mount package. A PCB
pad layout for the SOT-363
package is shown in Figure 15
(dimensions are in inches). This
layout provides ample allowance
for package placement by auto-
mated assembly equipment
without adding pad parasitics that
could impair the high frequency
performance of the INA-54063.
The layout is shown with a
nominal SOT-363 package foot-
print superimposed on the PCB
pads for reference.
0.026
0.035
0.075
0.016
Figure 15. PCB Pad Layout for
INA-54063 (dimensions in inches).
Statistical Parameters
Several categories of parameters
appear within this data sheet.
Parameters may be described
with values that are either
“minimum or maximum,” “typi-
cal,” or “standard deviations.”
The values for parameters are
based on comprehensive product
characterization data, in which
automated measurements are
made on of a minimum of 500
parts taken from 3 non-consecu-
tive process lots of semiconduc-
tor wafers. The data derived from
product characterization tends to
be normally distributed, e.g., fits
the standard “bell curve.”
Parameters considered to be the
most important to system perfor-
mance are bounded by minimum
or maximum values. For the
INA-54063, these parameters are:
Power Gain (|S21|2), Noise Figure
(NF), and Device Current (Id).
Each of these guaranteed param-
eters is 100% tested.
Values for most of the parameters
in the table of Electrical Specifi-
cations that are described by
typical data are the mathematical
mean (µ), of the normal distribu-
tion taken from the characteriza-
tion data. For parameters where
measurements or mathematical
averaging may not be practical,
such as S-parameters or Noise
Parameters and the performance
curves, the data represents a
nominal part taken from the
“center” of the characterization
distribution. Typical values are
intended to be used as a basis for
electrical design.
To assist designers in optimizing
not only the immediate circuit
using the INA-54063, but to also
optimize and evaluate trade-offs
that affect a complete wireless
system, the standard deviation
(σ) is provided for many of the
Electrical Specifications param-
eters (at 25°C) in addition to the
mean. The standard deviation is a
measure of the variability about
the mean. It will be recalled that a
normal distribution is completely
described by the mean and
standard deviation.
Standard statistics tables or
calculations provide the probabil-
ity of a parameter falling between
any two values, usually symmetri-
cally located about the mean.
Referring to Figure 16 for ex-
ample, the probability of a
parameter being between ± 1σ is
68.3%; between ± 2σ is 95.4%; and
between ± 3σ is 99.7%.
68%
95%
99%
-3σ -2σ -1σ Mean +1σ +2σ +3σ
(µ), typ
Parameter Value
Figure 16. Normal Distribution.
SMT Assembly
Reliable assembly of surface
mount components is a complex
process that involves many
material, process, and equipment
factors, including: method of
heating (e.g., IR or vapor phase
reflow, wave soldering, etc.)
circuit board material, conductor
thickness and pattern, type of
solder alloy, and the thermal
conductivity and thermal mass of
components. Components with a
low mass, such as the SOT-363
package, will reach solder reflow
temperatures faster than those
with a greater mass.
The INA-54063 is has been
qualified to the time-temperature
profile shown in Figure 17. This
profile is representative of an IR
reflow type of surface mount
assembly process.
After ramping up from room
temperature, the circuit board
with components attached to it
(held in place with solder paste)
passes through one or more
preheat zones. The preheat zones
increase the temperature of the
6-169
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