BD8381EFV-M
●Power consumption calculation
Pc(N) = ICC*VCC +
1
2
*Ciss*VREG*Fsw*VREG×2×2+
1
2
×Ciss×VREG×FPWM×VREG×2
ICC : Current of the maximum circuit
VCC :Power-supply voltage
Ciss : External FET capacity
Vsw : SW gate voltage
Fsw : SW frequency
FPWM : PWM frequency
<Calculation example>
When assuming
Pc(4)
=
10mA
×
30V
+
500pF
×
5V
×
300kHz
×
5V×2×2+
1
2
×1500pF×5×200×5×2,
it becomes
Pc = about 300mW.
4
(3) 3.12W
3
(2) 2.77W
(1) θja=66.5℃/W (Density of board copper foil3%)
(2) θja=45℃/W (Density of board copper foil34%)
(3) θja=40℃/W (Density of board copper foil60%)
2
(1) 1.88W
1
Technical Note
0
25
50
75
95 100
125
150
Ambient temperature Ta[℃]
Fig.22
Note1: The value of Power consumption : on glass epoxy board measuring 70mm×70mm×1.6mm
(1 layer board/Copper foil thickness 18µm)
Note2: The value changes depending on the density of the board copper foil.
However, this value is an actual measurement value and no guarantee value.
Pd=2200mW (968mW) : Density of the board copper foil 3%
Pd=3200mW (1408mW): Density of the board copper foil 34%
Pd=3500mW (1540mW): Density of the board copper foil 60% The value in () is a Power consumption of the Ta=125℃.
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2011.04 - Rev.A