BGY206 查看數據表（PDF） - Philips Electronics
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BGY206 Datasheet PDF : 16 Pages
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Philips Semiconductors
UHF amplifier module
Product specification
BGY206
handbook, full pagewidth
footprint metallization
solder area
occupied area
8.75
2.9
17.7
12.5
12
6
1.8
1.37
5.08
5.08
17.9
1.7
2.54
4
6.75
12.5
1
0.57
0.7
solder area
17.1
12.4
12.1
6.4
2.7 1.1
7.55
5.55
2.45
1.67
1.37
5.08
5.08
1.5
2.54
0.5
MGM150
Dimensions in mm.
1998 May 08
Fig.17 Footprint SOT388B.
10
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