BGY282 查看數據表（PDF） - Philips Electronics
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BGY282 Datasheet PDF : 12 Pages
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Philips Semiconductors
Preliminary specification
dual band UHF amplifier module for GSM900 and GSM1800
BGY282
PACKAGE OUTLINE
Leadless surface mounted package; plastic cap; 12 terminations
ZD (2×) e
e1
(4×)
(4×)
1
2
3
4
5
Z (2×)
SOT632A
Z5 (4×)
e2
(2×)
Z2
(6×)
12
6 Z7
(4×)
11
b (8×)
10
9
8
b1 (4×)
Dimensions of terminations
D
D1
L
(12×)
7
Z8
Z9
Z3
Z1
(2×)
(4×)
Dimensions of solderresist
A
c
Z4
(8×)
Z6 (4×)
pin 1 index
E1 E
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A b b1 c D D1 E E1 e e1 e2 L Z ZD Z1 Z2 Z3 Z4 Z5 Z6 Z7 Z8 Z9
mm
1.8
1.4
1.5 3.75 0.61 14.05 13.35 8.3
1.4 3.65 0.49 13.45 13.05 7.7
7.85
7.55
2.1 3.275 4.0
1.45 3.75 1.55 2.45 1.55 1.35 0.75
1.35 3.65 1.45 2.35 1.45 1.25 0.65
0.7 0.625 1.55 0.75 0.85
0.6 0.525 1.45 0.65 0.75
OUTLINE
VERSION
IEC
SOT632A
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
01-09-26
01-11-20
2001 Dec 04
10
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