BGY282 查看數據表（PDF） - Philips Electronics
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BGY282 Datasheet PDF : 12 Pages
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Philips Semiconductors
dual band UHF amplifier module for
GSM900 and GSM1800
APPLICATION INFORMATION
DCS out
Z0
+VS
C2
C4
C8
VB
DCS in
Z0
7 RF output 2
6
GND
PAM1
RF output 1 5
8 VS2
VS1 4
9 GND
GND 3
10
Vband
2
Vapc
11
RF output 2
GND
12
1
RF output 1
Preliminary specification
BGY282
Z0
+VS
C3
C1
C7
VC
Z0
RF in
Fig.6 Test circuit.
List of components
QUANTITY LOCATION VALUE / TYPE
DESCRIPTION
1
PCB
REMARK
1
PAM1
BGY282
Power amplifier module
4
Jack assembly end launch Type no. 142-0701-881
SMA connector
1
C1
100 µF / 35 V Electrol. capacitor
Type no. ECEV1VA101P
1
C2
100 µF / 35 V Electrol. capacitor
Type no. ECEV1VA101P
1
C3
100 nF
0805 size SMD capacitor
1
C4
100 nF
0805 size SMD capacitor
1
C7
680 pF
0603 size SMD capacitor
1
C8
100 pF
0603 size SMD capacitor
1
R1
100 Ohms / 0.1 0805 size SMD resistor
W
4
Z0
50 Ω
stripline; note 1
width 1.4 mm
Note
1. The striplines are on a double etched printed circuit board (εr = 4.6); thickness 0.8 mm
SUPPLIER
Roland
Haefele
Johnson
Components
Matsushita
Matsushita
2001 Dec 04
7
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