BGY925_4 查看數據表（PDF） - Philips Electronics
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BGY925_4 Datasheet PDF : 12 Pages
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Philips Semiconductors
UHF amplifier module
Product specification
BGY925
List of components (See Figs 14 and 15)
COMPONENT
DESCRIPTION
VALUE
CATALOGUE NO.
C1, C2
C3, C4
L1, L2
R1, R2
Z1, Z2
electrolytic capacitor
multilayer ceramic chip capacitor
Grade 4S2 Ferroxcube bead
metal film resistor
stripline; note 1
10 µF; 35 V
100 nF; 50 V
10 Ω; 0.4 W
50 Ω
4330 030 36300
2322 195 13109
Note
1. The striplines are on a double copper-clad printed-circuit board with epoxy dielectric (εr = 4.5); thickness = 1 mm.
MOUNTING RECOMMENDATIONS
To ensure a good thermal contact and to prevent
mechanical stress when bolted down, the flatness of the
mounting base is designed to be typically better than
0.1 mm. The mounting area of the heatsink should be flat
and free from burrs and loose particles. The heatsink
should be rigid and not prone to bowing under thermal
cycling conditions. The thickness of a solid heatsink
should be not less than 5 mm to ensure a rigid assembly.
A thin, even layer of thermal compound should be applied
between the mounting base and the heatsink to achieve
the best possible thermal contact resistance. Excessive
use of thermal compound will result in an increase in
thermal resistance and possible bowing of the
mounting-base; too little will also result in poor thermal
conduction.
The module should be mounted to the heatsink using
3 mm bolts with flat washers. The bolts should first be
tightened to “finger tight” and then further tightened in
alternating steps to a maximum torque of 0.4 to 0.6 Nm.
Once mounted on the heatsink, the module leads can be
soldered to the printed-circuit board. A soldering iron may
be used up to a temperature of 250 °C for a maximum of
10 seconds at a distance of 2 mm from the plastic cap.
ESD precautions must be taken to protect the device from
electrostatic damage.
2000 Feb 02
9
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