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CD4014 查看數據表(PDF) - Intersil

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CD4014 Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
CD40147BMS
Typical Performance Characteristics (Continued)
105 8
6
AMBIENT TEMPERATURE (TA) = +25oC
4
2 SUPPLY VOLTAGE (VDD) = 15V
104 8
6
4
5V
2
103 8
6
4
10V
2
102 8
6
4
2
10
1
LOAD CAPACITANCE
CL = 50pF
CL = 15pF
2 4 68 2 4 68 2 4 68 2 4 68 2 4 68
10
102
103
104
105
INPUT FREQUENCY (fIN) (kHz)
FIGURE 8. TYPICAL DYNAMIC POWER DISSIPATION AS A FUNCTION OF INPUT FREQUENCY
Chip Dimensions and Pad Layout
Dimensions in parenthesis are in millimeters and are
derived from the basic inch dimensions as indicated.
Grid graduations are in mils (10-3 inch).
METALLIZATION: Thickness: 11kÅ 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
7-78

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