Performance Information (cont’d)
Typical Thermal Characteristics (cont’d)
The theoretical calculations of these relationships
show the safe operating area of the CM3196 in the
SOIC package.
Thermal characteristics were measured using a dou-
ble-sided board with two square inches of copper area
connected to the GND pins for "heat spreading."
Measurements showing performance up to a junction
temperature of 150°C were performed under light load
conditions (5mA). This allows the ambient temperature
to be representative of the internal junction tempera-
ture.
Note: The use of multi-layer board construction with
separate ground and power planes will further enhance
the overall thermal performance.
CM3196
Figure 13. Output Voltage vs. Ambient
Temperature (ILOAD=5mA)
Figure 12. Reference Voltage vs. Temperature
Figure 14. Quiescent Current vs. Temperature
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04/22/04