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CXA2153S 查看數據表(PDF) - Sony Semiconductor

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CXA2153S Datasheet PDF : 24 Pages
First Prev 21 22 23 24
Package Outline
Unit: mm
30PIN SDIP (PLASTIC)
+ 0.4
26.9 0.1
30
16
1
15
1.778
CXA2153S
0° to 15°
SONY CODE
EIAJ CODE
JEDEC CODE
0.5 ± 0.1
0.9 ± 0.15
Two kinds of package surface:
1.All mat surface type.
2.All mirror surface type.
SDIP-30P-01
P-SDIP30-8.5x26.9-1.778
PACKAGE STRUCTURE
MOLDING COMPOUND EPOXY RESIN
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
PALLADIUM PLATING
COPPER ALLOY
1.8g
24
Sony Corporation

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