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CY14B256L-SP25XC 查看數據表(PDF) - Cypress Semiconductor

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产品描述 (功能)
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CY14B256L-SP25XC
Cypress
Cypress Semiconductor Cypress
CY14B256L-SP25XC Datasheet PDF : 18 Pages
First Prev 11 12 13 14 15 16 17 18
CY14B256L
Document History Page
Document Title: CY14B256L 256 Kbit (32K x 8) nvSRAM
Document Number: 001-06422
Rev.
ECN No.
Submission
Date
Orig. of
Change
Description of Change
**
425138
See ECN
TUP
New data sheet
*A 437321
See ECN
TUP
Show data sheet on External Web
*B 471966
See ECN
TUP
Changed VIH(min) from 2.2V to 2.0V
Changed tRECALL from 60 μs to 50 μs
Changed Endurance from one million cycles to 500K cycles
Changed Data Retention from 100 years to 20 years
Added Soft Sequence Processing Time Waveform
Updated Part Numbering Nomenclature and Ordering Information
*C 503277
See ECN
PCI
Changed from “Advance” to “Preliminary”
Changed the term “Unlimited” to “Infinite”
Changed endurance from 500K cycles to 200K cycles
Device operation: Tolerance limit changed from + 20% to + 15% in the
Features Section and Operating Range Table
Removed Icc1 values from the DC table for 25 ns and 35 ns industrial grade
Changed VSWITCH(min) from 2.55V to 2.45V
Added temperature specification to data retention - 20 years at 55°C
Changed the max value of Vcap storage capacitor from 120 μF to 57 μF
Updated Part Nomenclature Table and Ordering Information Table
*D 597004
See ECN
*E 696097
*F 1349963
See ECN
See ECN
TUP
VKN
SFV
Removed VSWITCH(min) specification from the AutoStore/Power Up RECALL
table
Changed tGLAX specification from 20 ns to 1 ns
Added tDELAY(max) specification of 70 μs in the Hardware STORE Cycle table
Removed tHLBL specification
Changed tSS specification from 70 μs (min) to 70 μs (max)
Changed VCAP(max) from 57 μF to 120 μF
Added footnote 6 related to HSB. Changed tGLAX to tGHAX
Changed from Preliminary to Final. Updated Ordering Information Table
*G 2483006
See ECN
GVCH/PYRS Changed tolerance from +15%, -10% to +20%, -10%
Changed Operating voltage range from 2.7V-3.45V to 2.7V-3.6V.
*H 2625139
01/30/09
GVCH/PYRS
Updated “features”
Updated WE pin description
Added data retention at 55oC
Added best practices
Added ICC1 spec for 25ns and 35ns access speed for industrial temperate
Updated VIH from Vcc+0.3 to Vcc+0.5
Removed footnote 4 and 5
Added Data retention and Endurance Table
Added Thermal resistance values
Changed parameter tAS to tSA
Changed tRECALL from 50us to 120us (Including tss of 70us)
Renamed tGLAX to tHA
Updated Figure 11 and 12
Renamed tHLHX to tPHSB
Updated Figure 12 and 13
Document Number: 001-06422 Rev. *H
Page 17 of 18
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