DAC1617D1G0HN 查看數據表（PDF） - Integrated Device Technology

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产品描述 (功能)

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DAC1617D1G0HN

Dual 16-bit DAC, LVDS interface, up to 1 Gsps, x2, x4 and x8 interpolating

Integrated Device Technology 

Integrated Device Technology

DAC1617D1G0

Dual 16-bit DAC: up to 1 Gsps; x2, x4 and x8 interpolating

 Embedded Numerically Controlled

 High resolution internal digital gain and

Oscillator (NCO) with 40-bit

offset control to support high

programmable frequency

performance IQ-modulator image

rejection

 Embedded complex(I/Q) digital IF

 Internal phase correction

modulator

 1.8 V and 3.3 V power supplies

 Inverse (sin x) / x function

 LVDS DDR compatible input interface  Power-down mode and Sleep mode;

with on-chip 100  terminations

5-bit NCO low-power mode

 LVDS DDR input clock up to 370 MHz  On-chip 1.25 V reference

 LVDS or LVPECL compatible DAC clock  Industrial temperature range 40 C to

+85 C

 Interleaved or folded I and Q data input  72 pins small form factor HVQFN

mode

package

3. Applications

 Wireless infrastructure: LTE, WiMAX, GSM, CDMA, WCDMA, TD-SCDMA

 Communications: LMDS/MMDS, point-to-point

 Direct Digital Synthesis (DDS)

 Broadband wireless systems

 Digital radio links

 Instrumentation

 Automated Test Equipment (ATE)

4. Ordering information

Table 1. Ordering information

Type number

Package

Name

Description

DAC1617D1G0HN HVQFN72 plastic thermal enhanced very thin quad flat package; no leads;

72 terminals; body 10  10  0.85 mm

Version

SOT813-3

DAC1617D1G0 3

Preliminary data sheet

Rev. 03 — 2 July 2012

© IDT 2012. All rights reserved.

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