DS1746-120IND 查看數據表（PDF） - Dallas Semiconductor -> Maxim Integrated

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DS1746-120IND

Y2KC Nonvolatile Timekeeping RAM

Dallas Semiconductor -> Maxim Integrated 

AC TEST CONDITIONS

Output Load:

100 pF + 1TTL Gate

Input Pulse Levels:

0.0 to 3.0V

Timing Measurement Reference Levels:

Input: 1.5V

Output: 1.5V

Input Pulse Rise and Fall Times: 5 ns

DS1746/DS1746P

NOTES:

1. Voltages are referenced to ground.

2. Typical values are at 25°C and nominal supplies.

3. Outputs are open.

4. Battery switch over occurs at the lower of either the battery terminal voltage or VPF.

5. Data retention time is at 25°C.

6. Each DS1746 has a built–in switch that disconnects the lithium source until VCC is first applied by the

user. The expected tDR is defined for DIP modules and assembled PowerCap modules as a cumulative

time in the absence of V CC starting from the time power is first applied by the user.

7. Real–Time Clock Modules (DIP) can be successfully processed through conventional wave–soldering

techniques as long as temperatures as long as temperature exposure to the lithium energy source

contained within does not exceed +85°C. Post solder cleaning with water washing techniques is

acceptable, provided that ultra-sonic vibration is not used.

In addition, for the PowerCap:

a. Dallas Semiconductor recommends that PowerCap Module bases experience one pass through

solder reflow oriented with the label side up (“live – bug”).

b. Hand Soldering and touch–up: Do not touch or apply the soldering iron to leads for more than

3 (three) seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To

remove the part, apply flux, heat the lead frame pad until the solder reflows and use a solder wick

to remove solder.

8. tAH1 , tDH1 are measured from WE going high.

9. tAH2 , tDH2 are measured from CE going high.

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