DS1746P
DS1746/DS1746P
PKG
DIM
A
B
C
D
E
F
G
MIN
0.920
0.980
-
0.052
0.048
0.015
0.025
INCHES
NOM MAX
0.925 0.930
0.985 0.990
-
0.080
0.055 0.058
0.050 0.052
0.020 0.025
0.027 0.030
NOTE:
Dallas Semiconductor recommends that PowerCap Module bases experience one pass through solder
reflow oriented with the label side up (“live – bug”).
Hand Soldering and touch–up: Do not touch or apply the soldering iron to leads for more than 3 (three)
seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove the part,
apply flux, heat the lead frame pad until the solder reflows and use a solder wick to remove solder.
16 of 18