DS1747P-70IND 查看數據表（PDF） - Dallas Semiconductor -> Maxim Integrated

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DS1747P-70IND

Y2K-Compliant, Nonvolatile Timekeeping RAMs

Dallas Semiconductor -> Maxim Integrated 

DS1747/DS1747P Y2K-Compliant, Nonvolatile Timekeeping RAMs

AC TEST CONDITIONS

Output Load: 50 pF + 1TTL Gate

Input Pulse Levels: 0 to 3.0V

Timing Measurement Reference Levels:

Input: 1.5V

Output: 1.5V

Input Pulse Rise and Fall Times: 5 ns

NOTES:

1) Voltages are referenced to ground.

2) Typical values are at +25°C and nominal supplies.

3) Outputs are open.

4) Battery switchover occurs at the lower of either the battery terminal voltage or VPF.

5) Data-retention time is at +25°C.

6) Each DS1747 has a built-in switch that disconnects the lithium source until the user first applies VCC.

The expected tDR is defined for DIP modules and assembled PowerCap modules as accumulative time

in the absence of VCC starting from the time power is first applied by the user.

7) RTC Modules (DIP) can be successfully processed through conventional wave-soldering techniques

as long as temperatures as long as temperature exposure to the lithium energy source contained

within does not exceed +85°C. Post-solder cleaning with water-washing techniques is acceptable,

provided that ultra-sonic vibration is not used.

In addition, for the PowerCap:

a) Dallas Semiconductor recommends that PowerCap Module bases experience one pass through

solder reflow oriented with the label side up (“live-bug”).

b) Hand soldering and touch-up: Do not touch or apply the soldering iron to leads for more than

3 seconds. To solder, apply flux to the pad, heat the lead frame pad, and apply solder. To remove

the part, apply flux, heat the lead frame pad until the solder reflows, and use a solder wick to

remove solder.

8) tAH1, tDH1 are measured from WE going high.

9) tAH2, tDH2 are measured from CE going high.

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