DS1747-70IND 查看數據表（PDF） - Dallas Semiconductor -> Maxim Integrated

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DS1747-70IND

Y2K-Compliant, Nonvolatile Timekeeping RAMs

Dallas Semiconductor -> Maxim Integrated 

DS1747/DS1747P Y2K-Compliant, Nonvolatile Timekeeping RAMs

PACKAGE INFORMATION (continued)

(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package

outline information, go to www.maxim-ic.com/DallasPackInfo.)

34-PIN PowerCap

PKG DIM

MODULE

MIN NOM MAX

A IN 0.920 0.925 0.930

B IN 0.980 0.985 0.990

C IN

—

— 0.080

D IN 0.052 0.055 0.058

E IN 0.048 0.050 0.052

F IN 0.015 0.020 0.025

G IN 0.025 0.027 0.030

NOTE: DALLAS SEMICONDUCTOR RECOMMENDS THAT POWERCAP MODULE

BASES EXPERIENCE ONE PASS THROUGH SOLDER REFLOW ORIENTED WITH THE

LABEL SIDE UP (“LIVE-BUG”).

NOTE: HAND SOLDERING AND TOUCH-UP: DO NOT TOUCH OR APPLY THE

SOLDERING IRON TO LEADS FOR MORE THAN 3 SECONDS. TO SOLDER, APPLY FLUX

TO THE PAD, HEAT THE LEAD FRAME PAD, AND APPLY SOLDER. TO REMOVE THE

PART, APPLY FLUX, HEAT THE LEAD FRAME PAD UNTIL THE SOLDER REFLOWS, AND

USE A SOLDER WICK TO REMOVE SOLDER.

COMPONENTS AND PLACEMENT MAY VARY FROM EACH DEVICE TYPE.

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