DSPIC33FJ32GP202(2007) 查看數據表（PDF） - Microchip Technology

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DSPIC33FJ32GP202
(Rev.:2007)

High-Performance, 16-Bit Microcontrollers

Microchip Technology 

dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304

44-Lead Plastic Quad Flat, No Lead Package (ML) – 8x8 mm Body [QFN]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

D

EXPOSED

D2

PAD

e

E

E2

b

2

2

1

1

N

NOTE 1

N

L

K

TOP VIEW

BOTTOM VIEW

A

A3

A1

Units

MILLIMETERS

Dimension Limits

MIN

NOM

Number of Pins

N

44

Pitch

e

0.65 BSC

Overall Height

A

0.80

0.90

Standoff

A1

0.00

0.02

Contact Thickness

A3

0.20 REF

Overall Width

E

8.00 BSC

Exposed Pad Width

E2

6.30

6.45

Overall Length

D

8.00 BSC

Exposed Pad Length

D2

6.30

6.45

Contact Width

b

0.25

0.30

Contact Length

L

0.30

0.40

Notes:

Contact-to-Exposed Pad

K

0.20

–

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Package is saw singulated.

3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

MAX

1.00

0.05

6.80

6.80

0.38

0.50

–

Microchip Technology Drawing C04-103B

© 2007 Microchip Technology Inc.

Preliminary

DS70290A-page 239

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