UPC2756TB-E3 查看數據表（PDF） - NEC => Renesas Technology

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UPC2756TB-E3

MIXER+OSCILLATOR SILICON MMIC FOR FREQUENCY DOWNCONVERTER OF L BAND WIRELESS RECEIVER

NEC => Renesas Technology 

µPC2756TB

NOTE ON CORRECT USE

(1) Observe precautions for handling because of electro-static sensitive devices.

(2) Form a ground pattern as widely as to minimize ground impedance (to prevent abnormal oscillation).

(3) Keep the track length between the ground pins as short as possible.

(4) Connect a bypass capacitor (example 1 000 pF) to the VCC pin.

(5) To construct oscillator, tank circuit must be externally attached to pin 3 and 4.

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered under the following recommended conditions. For soldering methods and

conditions other than those recommended below, contact your NEC sales representative.

µPC2756TB

Soldering Method

Infrared Reflow

VPS

Wave Soldering

Partial Heating

Soldering Conditions

Package peak temperature: 235 °C or below

Time: 30 seconds or less (at 210 °C)

Count: 3, Exposure limitNote: None

Package peak temperature: 215 °C or below

Time: 40 seconds or less (at 200 °C)

Count: 3, Exposure limitNote: None

Soldering bath temperature: 260 °C or below

Time: 10 seconds or less

Count: 1, Exposure limitNote: None

Pin temperature: 300 °C

Time: 3 seconds or less (per side of device)

Exposure limitNote: None

Recommended Condition Symbol

IR35-00-3

VP15-00-3

WS60-00-1

–

Note After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.

Caution Do not use different soldering methods together (except for partial heating).

For details of recommended soldering conditions for surface mounting, refer to information document

SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).

14

Data Sheet P12807EJ2V0DS00

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