EL8178FSZ 查看數據表（PDF） - Intersil
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EL8178FSZ Datasheet PDF : 15 Pages
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EL8178
Wafer Level Chip Scale Package (WLCSP)
E
PIN 1 ID
D
TOP VIEW
A2
A
A1
b
SIDE VIEW
W3x2.6C
3x2 ARRAY 6 BALL WAFER LEVEL CHIP SCALE PACKAGE
SYMBOL
MILLIMETERS
A
0.51 Min, 0.55 Max
A1
0.225 ±0.015
A2
0.305 ±0.013
b
Φ0.323 ±0.025
D
0.955 ±0.020
D1
0.50 BASIC
E
1.455 ±0.020
E1
1.00 BASIC
e
0.50 BASIC
SD
0.25 BASIC
SE
0.00 BASIC
Rev. 3 03/08
NOTES:
1. All dimensions are in millimeters.
SD
D1
b
E1
e
SE
2
1
C
B
A
BOTTOM VIEW
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
15
FN7504.6
March 17, 2008
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