FIN212AC(2008) 查看數據表（PDF） - Fairchild Semiconductor
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产品描述 (功能)
生产厂家
FIN212AC
(Rev.:2008)
(Rev.:2008)
Fairchild Semiconductor
FIN212AC Datasheet PDF : 23 Pages
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Tape and Reel Specifications
MLP Embossed Tape Dimensions
Dimensions are in millimeters unless otherwise noted.
P0
D
T
K0
Wc
B0
P2
E
F
W
Tc
A0
P1
D1
User Direction of Feed
Package
A0
±0.1
B0
±0.1
D
±0.5
D1
Min.
E
F
K0
P1
P0
±0.1 ±0.1 ±0.1 Typ. Typ.
P2
±0.5
T
TC
W
WC
Typ. ±0/05 ±0.3 Typ.
5x5
5.35
5.35
1.55
1.50
1.75 5.50 1.40 8.00 4.00
2.00
0.30
0.07 12.00 9.30
6x6
5.35
5.35
1.55
1.50
1.75 5.50 1.40 8.00 4.00
2.00
0.30
0.07 12.00 9.30
Notes:
A0, B0, and K0 dimensions are determined with respect to the EIA/JEDEC RS-481 rotational and lateral movement
requirements (see sketches A, B, and C).
MLP Shipping Reel Dimensions
Dimensions are in millimeters unless otherwise noted.
10° maximum
Typical component
B0
10° maximum component rotation
cavity center line
Typical component
center line
Sketch A (Side or Front Sectional View)
Component Rotation
A0
Sketch B (Top View)
Component Rotation
1.0mm
maximum
1.0mm
maximum
Sketch C (Top View)
Component Lateral Movement
Dia A
max
Tape
Width
8
12
16
Dia A
Max.
330.0
330.0
330.0
W2 max Measured at Hub
W1 Measured at Hub
B Min
Dia N
Dia D
min
Dia C
Dim B
Min.
1.5
1.5
1.5
See detail AA
Dia C
+0.5/-0.2
13.0
13.0
13.0
Dia D
Min.
20.2
20.2
20.2
W3
Dim N
Min.
178.0.
178.0.
178.0.
DETAIL AA
Dim W1
+2.0/-0
8.4
12.4
16.4
Dim W2
14.4
18.4
22.4
Dim W3
(LSL-USL)
7.9 ~ 10.4
11.9 ~ 15.4
15.9 ~ 19.4
© 2006 Fairchild Semiconductor Corporation
FIN212AC Rev. 1.0.6
18
www.fairchildsemi.com
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