Die Characteristics
DIE DIMENSIONS
63 mils x 44 mils x 19 mils
1600µm x 1130µm 483µm
METALLIZATION
Type: Metal 1: AlCu (2%)/TiW
Thickness: Metal 1: 8kÅ ±0.4kÅ
Type: Metal 2: AlCu (2%)
Thickness: Metal 2: 16kÅ ±0.8kÅ
Metallization Mask Layouts
HFA1112
NC
V-
HFA1112, HFA1112A
PASSIVATION
Type: Nitride
Thickness: 4kÅ ±0.5kÅ
TRANSISTOR COUNT
52
SUBSTRATE POTENTIAL (POWERED UP)
Floating (Recommend Connection to V-)
HFA1112A
NC
+IN
+IN
V-
-IN
-IN
NC
NC
NC
NC
NC
NC
V+
V+
OUT
OUT
12