HI-1573 查看數據表（PDF） - Holt Integrated Circuits

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产品描述 (功能)

生产厂家

HI-1573

MIL-STD-1553 3.3V Monolithic Dual Transceivers

Holt Integrated Circuits 

PACKAGE DIMENSIONS

20-PIN PLASTIC SMALL OUTLINE (ESOIC) - WB

(Wide Body, Thermally Enhanced)

12.80

(0.504)

BSC

0.215 ± 0.115

(0.008 ± 0.005)

millimeters (inches)

Package Type: 20HWE

7.495 ± 0.385

(0.295 ± 0.015)

(100.4.3037)BSC

Top View

7.50

(0.295)

BSC

5.335 ± 0.385

(0.210 ± 0.015)

Bottom

View

0.419 ± 0.109

(0.016 ± 0.004)

See Detail A

2.181 ± 0.131

(0.086 ± 0.005)

1.27

(0.50)

BSC

BSC = “Basic Spacing between Centers”

is theoretical true position dimension and

has no tolerance. (JEDEC Standard 95)

0° to 8°

0.835 ± 0.435

(0.033 ± 0.017)

0.200 ± 0.100

(0.008 ± 0.004)

Detail A

Electrically isolated heat

sink pad on bottom of

package

Connect to any ground or

power plane for optimum

thermal dissipation

20-PIN CERAMIC SIDE-BRAZED DIP

inches (millimeters)

Package Type: 20C

1.000 ±.010

(25.400 ±.254)

.200

(5.080)

max

.050 TYP.

(1.270 TYP.)

.310 ±.010

(7.874 ±.254)

.085 ±.009

(2.159 ± .229)

.300 ± .010

(7.620 ± .254)

.125 min

(3.175)

BSC = “Basic Spacing between Centers”

is theoretical true position dimension and

has no tolerance. (JEDEC Standard 95)

.017 ±.002

(.432 ±.051)

.100

(2.54) BSC

HOLT INTEGRATED CIRCUITS

10

.010 + 0. 02/-.001

(.254 ±.051/-.025)

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