HSDL-3208-021 查看數據表（PDF） - HP => Agilent Technologies
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HSDL-3208-021
HP => Agilent Technologies
HSDL-3208-021 Datasheet PDF : 18 Pages
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Application Support Information
The Application Engineering
group in Agilent Technologies is
available to assist you with the
technical understanding
associated with HSDL-3208
infrared transceiver module. You
can contact them through your
local Agilent sales representatives
for additional details.
Order Information
Part Number
HSDL-3208-021
Packaging Type
Tape and Reel
Package
Front View
Quantity
2500
I/O Pins Configuration Table
Pin
Symbol
Description
I/O Type
Notes
1
LED A
LED Anode
Input
1
2
LED C
LED Cathode
Input
2
3
TXD
Transmit Data
Input, Active High
3
4
RXD
Receive Data
Output, Active Low
4
5
SD/Mode
Shutdown
Input, Active High
5
6
VCC
Supply Voltage
Supply Voltage
6
7
GND
Ground
Ground
7
Notes:
1. This pin can be connected directly to VCC (i.e. without series resistor) at less than 3 V.
2. Internally connected to the LED driver.
3. This pin is used to transmit serial data when SD pin is low. Do not float the pin.
4. This pin is capable of driving a standard CMOS or TTL load. No external pull-up or pull down resistor is required. It is in tri-state
mode when the transceiver is in shutdown mode.
5. The transceiver is in shutdown mode if this pin is high. Do not float the pin.
6. Regulated, 2.7 to 3.6 volts.
7. Connect to system ground.
Recommended Application Circuit Components
Component
Recommended Value
Notes
R1
2.7 Ω ± 5%, 0.25 Watt for 2.7 <= VCC <= 3.6 V
CX1
0.47 µF ± 20%, X7R Ceramic
8
CX2
6.8 µF ± 20%, Tantalum
9
Notes:
8. CX1 must be placed within 0.7 cm of the HSDL-3208 to obtain optimum noise immunity.
9. In environments with noisy power supplies, supply rejection performance can be enhanced
by including CX2, as shown in “Figure 1: HSDL-3208 Functional Block Diagram” in Page 1.
2
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