HSDL-3208-021 查看數據表（PDF） - HP => Agilent Technologies
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HSDL-3208-021
HP => Agilent Technologies
HSDL-3208-021 Datasheet PDF : 18 Pages
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Moisture Proof Packaging
All HSDL-3208 options are
shipped in moisture proof
package. Once opened, moisture
absorption begins.
This part is compliant to JEDEC
Level 4.
UNITS IN A SEALED
MOISTURE-PROOF
PACKAGE
PACKAGE IS
OPENED (UNSEALED)
NO BAKING
IS NECESSARY
YES
ENVIRONMENT
LESS THAN 30°C,
AND LESS THAN
60% RH
YES
PACKAGE IS
OPENED LESS
THAN 72 HOURS
NO
PERFORM RECOMMENDED
NO
BAKING CONDITIONS
Figure 12. Baking conditions chart.
Baking Conditions
If the parts are not stored in dry
conditions, they must be baked
before reflow to prevent damage
to the parts.
Package Temp. Time
In reels
60°C ≥ 48 hours
In bulk
100°C ≥ 4 hours
125°C ≥ 2 hours
150°C ≥ 1 hour
Baking should only be done once.
Recommended Storage Conditions
Storage
Temperature
10°C to 30°C
Relative
Humidity
below 60% RH
Time from Unsealing to Soldering
After removal from the bag, the
parts should be soldered within
two days if stored at the recom-
mended storage conditions. If
times longer than 72 hours are
needed, the parts must be stored
in a dry box.
8
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