IS25C128A 查看數據表（PDF） - Integrated Silicon Solution
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IS25C128A Datasheet PDF : 17 Pages
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IS25C128A
300-mil Plastic DIP
Package Code: N,P
N
1
S
S
L
FOR
32-PIN ONLY
e
D
B1
B
E1
SEATING PLANE
A
E
C
A1
B2
eA
MILLIMETERS
Sym. Min.
Max.
N0.
Leads
8
A
3.68
4.57
A1
0.38
—
B
0.36
0.56
B1
1.14
1.52
B2
0.81
1.17
C
0.20
0.33
D
9.12
9.53
E
7.62
8.26
E1
6.20
6.60
eA
8.13
9.65
e
2.54 BSC
L
3.18
S
0.64
—
0.762
INCHES
Min.
Max.
0.145
0.180
0.015
—
0.014
0.022
0.045
0.060
0.032
0.046
0.008
0.013
0.359
0.375
0.300
0.325
0.244
0.260
0.320
0.380
0.100 BSC
0.125
0.025
—
0.030
Notes:
1. Controlling dimension: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should
be measured from the bottom of the package.
4. Formed leads shall be planar with respect to one another within 0.004
inches at the seating plane.
Integrated Silicon Solution, Inc.
17
AdvancedInformation Rev. 00E
11/25/08
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