IS25C256 查看數據表（PDF） - Integrated Silicon Solution

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IS25C256

128K-bit/ 256K-bit SPI SERIAL ELECTRICALLY ERASABLE PROM

Integrated Silicon Solution 

PACKAGING INFORMATION

200-mil Plastic SOP

Package Code: W

ISSI®

N

1

D

EH

SEATING PLANE

A

A1

L

e

B

α

C

Notes:

1. Controlling dimension: mm, unless otherwise specified.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E1 do not include mold flash protrusions

and should be measured from the bottom of the package.

200-mil Plastic SOP (W)

Symbol Min Max

Min Max

Ref. Std.

Inches

mm

No. Leads

8

8

A

— 0.085

— 2.16

A1 0.004 0.009

B 0.014 0.018

0.10 0.23

0.35 0.45

C 0.006 0.014

0.15 0.35

D 0.203 0.211

E 0.204 0.213

5.15 5.35

5.18 5.40

H 0.303 0.325

7.70 8.26

e

0.050 BSC

L 0.020 0.033

1.27 BSC

0.51 0.85

Integrated Silicon Solution, Inc. — 1-800-379-4774

2

Rev. A

10/20/05

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