ISL21070(2011) 查看數據表（PDF） - Intersil
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ISL21070 Datasheet PDF : 11 Pages
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ISL21070
Typical Performance Characteristics Curves
VOUT = 2.5V, VIN = 3V, IOUT = 0mA, TA = +25°C unless otherwise specified. (Continued)
120
100
80
60
40
20
0
1
NO LOAD
1nF LOAD
10nF LOAD
100nF LOAD
10
100
1k
10k
100k
1M
FREQUENCY (Hz)
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
1
FIGURE 14. ZOUT vs f vs CL
1nF LOAD
10nF LOAD
NO LOAD
100nF LOAD
10
100 1k
10k 100k
FREQUENCY (Hz)
FIGURE 15. PSRR vs FREQUENCY
1M 10M
1s/DIV
FIGURE 16. VOUT NOISE, 0.1Hz TO 10Hz
Applications Information
FGA Technology
The ISL21070 series of voltage references use the floating gate
technology to create references with very low drift and supply
current. Essentially, the charge stored on a floating gate cell is set
precisely in manufacturing. The reference voltage output itself is a
buffered version of the floating gate voltage. The resulting reference
device has excellent characteristics which are unique in the industry:
very low temperature drift, high initial accuracy, and almost zero
supply current. Also, the reference voltage itself is not limited by
voltage bandgaps or zener settings, so a wide range of reference
voltages can be programmed (standard voltage settings are
provided, but customer-specific voltages are available).
The process used for these reference devices is a floating gate
CMOS process, and the amplifier circuitry uses CMOS transistors
for amplifier and output transistor circuitry. While providing
excellent accuracy, there are limitations in output noise level and
load regulation due to the MOS device characteristics. These
limitations are addressed with circuit techniques discussed in
other sections.
Handling and Board Mounting
FGA references provide excellent initial accuracy and low
temperature drift at the expense of very little power drain. There
are some precautions to take to insure this accuracy is not
compromised. Excessive heat during solder reflow can cause
excessive initial accuracy drift, so the recommended +260°C
max temperature profile should not be exceeded. Expect up to
1mV drift from the solder reflow process.
FGA references are susceptible to excessive X-radiation like that
used in PC board manufacturing. Initial accuracy can change
10mV or more under extreme radiation. If an assembled board
needs to be X-rayed, care should be taken to shield the FGA
reference device.
7
FN7599.2
July 1, 2011
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