NXP Semiconductors
KTY81 series
Silicon temperature sensors
Table 13. Tape specification
Symbol Dimension
A1
A
T
P
P0
P2
F
∆h
W
W0
W1
W2
H0
H1
L
D0
t
F1, F2
H2
(p)
body width
body height
body thickness
pitch of component
feed hole pitch
cumulative pitch error
feed hole center to component
center
lead-to-lead distance
component alignment
tape width
hold-down tape width
hole position
hold-down tape position
lead wire clinch height
component height
length of snipped leads
feed hole diameter
total tape thickness
lead to snipped lead distance
clinch height
pull-out force
9. Revision history
Specifications
Min Typ Max
4.4 -
4.8
5-
5.2
3.6 -
4.2
- 12.7 -
- 12.7 -
−1 -
+1
- 6.35 -
Tolerance
-
-
-
±1
±0.3
-
±0.4
- 5.08 -
+0.6/−0.2
-
0
1
-
- 18 -
±0.5
-
6
-
±0.2
-
9
-
+0.7/−0.5
- 0.5 -
±0.2
- 16.5 -
±0.5
--
23.25 -
--
11
-
-
4
-
±0.2
--
1.2 -
- 2.54 -
+0.4/−0.2
- 2.5 -
+0.5/0
6-
-
-
Remarks
Unit
mm
mm
mm
mm
mm
mm measured over 20 devices
mm to be measured at bottom of
clinch
mm spread leads
mm at top of body
mm
mm
mm
mm
mm
mm
mm
mm
mm t1 = 0.3 mm to 0.6 mm
mm spread leads
mm
N
Table 14. Revision history
Document ID
Release date Data sheet status
Change notice Supersedes
KTY81_SER_5
Modifications:
20080425
Product data sheet
-
KTY81-2SERIES_4
KTY81-1SERIES_3
• The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
KTY81-2SERIES_4
20000825
Product specification
-
-
KTY81-1SERIES_3
20000825
Product specification
-
-
KTY81_SER_5
Product data sheet
Rev. 05 — 25 April 2008
© NXP B.V. 2008. All rights reserved.
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