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L6374 查看數據表(PDF) - STMicroelectronics

零件编号
产品描述 (功能)
生产厂家
L6374
ST-Microelectronics
STMicroelectronics ST-Microelectronics
L6374 Datasheet PDF : 19 Pages
First Prev 11 12 13 14 15 16 17 18 19
Package mechanical data
13 Package mechanical data
L6374
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
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