LMV321 查看數據表（PDF） - ON Semiconductor

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LMV321

Single, Dual, Quad Low-Voltage, Rail-to-Rail Operational Amplifiers

ON Semiconductor 

LMV321, LMV358, LMV324

PACKAGE DIMENSIONS

UDFN8 1.8x1.2, 0.4P

CASE 517AJ−01

ISSUE O

D

0.10 C

AB

PIN ONE

REFERENCE

ÉÉÉÉ 0.10 C

E

TOP VIEW

L1

DETAIL A

NOTE 5

0.05 C

(A3)

0.05 C

A1

SIDE VIEW

A

C

SEATING

PLANE

e/2

(b2)

1

e

DETAIL A

8X L

4

(L2)

8

5

BOTTOM VIEW

8X b

0.10 M

0.05 M

CAB

C NOTE 3

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.30 mm FROM TERMINAL TIP.

4. MOLD FLASH ALLOWED ON TERMINALS

ALONG EDGE OF PACKAGE. FLASH MAY

NOT EXCEED 0.03 ONTO BOTTOM

SURFACE OF TERMINALS.

5. DETAIL A SHOWS OPTIONAL

CONSTRUCTION FOR TERMINALS.

MILLIMETERS

DIM MIN MAX

A 0.45 0.55

A1 0.00 0.05

A3 0.127 REF

b 0.15 0.25

b2 0.30 REF

D 1.80 BSC

E 1.20 BSC

e 0.40 BSC

L 0.45 0.55

L1 0.00 0.03

L2 0.40 REF

MOUNTING FOOTPRINT*

SOLDERMASK DEFINED

7X

0.22

8X

0.66

1.50

1

0.32

0.40 PITCH

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

http://onsemi.com

17

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