LTC3521 查看數據表（PDF） - Linear Technology
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LTC3521 Datasheet PDF : 22 Pages
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LTC3521
Package Description
FE Package
20-LFeEaPdacPklaagsetic TSSOP (4.4mm)
20-(LReeafderPelnascteicLTTCSSDOWPG(4#.40m5m-0)8-1663 Rev J)
(Reference LTC DWG # 05-08-1663 Rev J)
ExposEedxpPaodsVeadriaPtiaodn CVBariation CB
3.86
(.152)
6.40 – 6.60*
(.252 – .260)
3.86
(.152)
20 1918 17 16 15 14 1312 11
6.60 ±0.10
4.50 ±0.10
SEE NOTE 4
2.74
(.108)
0.45 ±0.05
1.05 ±0.10
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT
4.30 – 4.50*
(.169 – .177)
0.25
REF
0° – 8°
2.74
(.108)
6.40
(.252)
BSC
1 2 3 4 5 6 7 8 9 10
1.20
(.047)
MAX
0.09 – 0.20
(.0035 – .0079)
0.50 – 0.75
(.020 – .030)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2.
DIMENSIONS
ARE
IN
MILLIMETERS
(INCHES)
3. DRAWING NOT TO SCALE
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
TYP
0.05 – 0.15
(.002 – .006)
FE20 (CB) TSSOP REV J 1012
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
4.50 ±0.05
2.45 ±0.05
3.10 ±0.05 (4 SIDES)
UF Package
((RR22e4e4f-ef-LerLeerneeacndaecdPLeTlPaLCUTslDatCFiWscPDtGQaiWccF#kNGQ0a5(gF#4-e0Nm085-m(1-460×m987-4m1Rm6em×v97B)4)Rmemv B))
0.70 ±0.05
4.00 ±0.10
(4 SIDES)
PIN 1
TOP MARK
(NOTE 6)
0.75 ±0.05
2.45 ±0.10
(4-SIDES)
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
23 24
PIN 1 NOTCH
R = 0.20 TYP
OR 0.35 × 45°
CHAMFER
0.40 ±0.10
1
2
PACKAGE
OUTLINE
(UF24) QFN 0105 REV B
0.25 ±0.05
0.50 BSC
0.200 REF
0.00 – 0.05
0.25 ±0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-X)—TO BE APPROVED
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
20
For more information www.linear.com/LTC3521
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