LX1671 查看數據表（PDF） - Microsemi Corporation
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LX1671 Datasheet PDF : 21 Pages
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LX1671
TM
®
Multiple Output LoadSHARE™ PWM
PRODUCTION DATA SHEET
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (VCC) DC ................................................................-0.3V to 5.5V
Supply Voltage (VCC) Transient ......................................................-0.3V to 6.0V
Driver Supply Voltage (VCx, VCCL) DC ............................................-0.3V to 12V
Driver Supply Voltage (VCx, VCCL) Transient ...................................-0.3V to 14V
Linear Regulator Gate Drive, VLDGD ...................................................-0.3V to 9V
Current Sense Inputs (VSX, CSX) ....................................................... -0.3V to 12V
Error Amplifier Inputs (FBX, RF2, LDFB)........................................-0.3V to 5.5V
Input Voltage (SS/Enable, LDDIS) ...................................................-0.3V to5.5V
Output Drive Peak Current Source (HOx, LOx)....................................1A (500ns)
Output Drive Peak Current Sink (HOx, LOx) .......................................1A (500ns)
Operating Junction Temperature.................................................................. 150°C
Storage Temperature Range...........................................................-65°C to 150°C
RoHS Peak Package Solder Reflow Temperature
(40 second maximum exposure) ..................................................... 260°C (+0, -5)
Note:
Exceeding these ratings could cause damage to the device. All voltages are
with respect to Ground. Currents are positive into, negative out of specified
terminal.
The limitation on transient time is thermal and is due to zener diodes on the
supply pins, application of maximum voltages will increase current into that
pin and increase package power dissipation.
x = Denotes Phase 1, 2, or 3
THERMAL DATA
PW Plastic TSSOP 38-Pin
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
85°C/W
LQ Plastic MLP 38-Pin
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
35°C/W
Junction Temperature Calculation: TJ = TA + (PD x θJC).
The θJA numbers are guidelines for the thermal performance of the device/pc-board
system. All of the above assume no ambient airflow.
PACKAGE PIN OUT
LO1
PG1
LO2
HO2
VC2
LDGD
LDFB
LDDIS
DGND
AGND
RSVD
SS2
RF2
FB2
EO2
CS2
VS2
SS1
FB1
1
38
19
20
PW PACKAGE
(Top View)
H01
VC1
VC3
HO3
LO3
PG3
VCCL
VCC
N/U
VS3
CS3
N.C.
N.C.
EO3
FB3
SS3
VS1
CS1
EO1
HO2
VC2
LDGD
LDFB
LDDIS
DGND
AGND
RSVD
SS2
RF2
FB2
EO2
1 38 37 36 35 34 33 32 31
2
30
3
29
4
28
5
Connect
27
6
Bottom
26
7
to Power
25
GND
8
24
9
23
10
22
11
21
12 13 14 15 16 17 18 19 20
LO3
PG3
VCCL
VCC
N.C.
N.C.
VS3
CS3
N.C.
EO3
FB3
SS3
LQ PACKAGE
(Top View)
N.C. – No Internal Connection
N/U – Not Used
RSVD – Do Not Use
RoHS / Pb-free 100% Matte Tin Lead Finish
Copyright © 2000
Rev. 1.2b, 2006-02-13
Microsemi
Integrated Products, Power Management
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
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