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M50FW040(2006) 查看數據表(PDF) - STMicroelectronics

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M50FW040 Datasheet PDF : 53 Pages
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Revision history
13 Revision history
M50FW040
Table 28. Document revision history
Date
Version
Changes
September 2000 -01 First Issue
04-Oct-2000
11-Apr-01
06-Jul-2001
12-Mar-2002
09-Jul-2004
12-Jul-2004
-02 DC Characteristics: ICC4 changed
Document type: from Preliminary Data to Data Sheet
Program and Erase functions clarification
Read Electronic Signature table change
FWH Register Configuration Map table change
Input Register Definition table, note clarification
-03 DC Characteristics parameters clarification and new VIH and VIL
parameters added
FWH Interface AC Signal Timing Characteristics change
A/A Mux Interface Read AC Characteristics change
A/A Mux Interface Write AC Characteristics change
A/A Mux Interface Write AC Waveforms change
-04 Note 2 changed (Table 13: Absolute maximum ratings)
RFU pins must be left disconnected
-05
Specification of PLCC32 package mechanical data revised
Revision numbering modified.
Document imported in new template (and so reformatted).
6.0 Temperature Range ordering information replaced by Device Grade,
Standard packing option added and Plating Technology added to
Table 27: Ordering information scheme. TLEAD parameter added to
Table 13: Absolute maximum ratings and TBIAS parameter removed.
7.0 Inches values corrected in Table 27: Ordering information scheme.
10-Nov-2004
24-Oct-2006
8.0
TSOP32 package added. Figure 2: Logic diagram (A/A Mux Interface)
and Table 2: Signal names (A/A Mux interface) added.
Document converted to new ST template.
Packages are ECOPACK® compliant. TLEAD removed from Table 13:
9 Absolute maximum ratings.
Device grade 1 removed. Blank Plating Technology option removed
from Table 27: Ordering information scheme.
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