MAC15SD, MAC15SM, MAC15SN
THERMAL CHARACTERISTICS
Thermal Resistance,
Characteristic
Junction−to−Case
Junction−to−Ambient
Maximum Lead Temperature for Soldering Purposes 1/8″ from Case for 10 Seconds
Symbol
RqJC
RqJA
TL
Value
2.0
62.5
260
Unit
°C/W
°C
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted; Electricals apply in both directions)
Characteristic
Symbol Min Typ Max
OFF CHARACTERISTICS
Peak Repetitive Blocking Current
(VD = Rated VDRM, VRRM; Gate Open)
ON CHARACTERISTICS
Peak On-State Voltage (Note 2) (ITM = "21A)
Gate Trigger Current (Continuous dc) (VD = 12 V, RL = 100W)
MT2(+), G(+)
MT2(+), G(−)
MT2(−), G(−)
TJ = 25°C
TJ = 110°C
IDRM,
IRRM
VTM
IGT
−
− 0.01
−
−
2.0
−
−
1.8
−
2.0 5.0
−
3.0 5.0
−
3.0 5.0
Hold Current (VD = 12 V, Gate Open, Initiating Current = "150mA)
Latching Current (VD = 24V, IG = 5mA)
MT2(+), G(+)
MT2(+), G(−)
MT2(−), G(−)
IH
−
3.0 10
IL
−
5.0 15
−
10
20
−
5.0 15
Gate Trigger Voltage (Continuous dc) (VD = 12 V, RL = 100W)
MT2(+), G(+)
MT2(+), G(−)
MT2(−), G(−)
VGT
0.45 0.62 1.5
0.45 0.60 1.5
0.45 0.65 1.5
DYNAMIC CHARACTERISTICS
Rate of Change of Commutating Current
(di/dt)c
8.0 10
−
(VD = 400V, ITM = 3.5A, Commutating dv/dt = 10Vm/sec,
Gate Open, TJ = 110°C, f= 500Hz, Snubber: CS = 0.01 mF, RS =15W, see Figure 15)
Critical Rate of Rise of Off-State Voltage
(VD = Rate VDRM, Exponential Waveform, RGK = 510W, TJ = 110°C)
dv/dt
25
75
−
2. Pulse Test: Pulse Width ≤ 2.0 ms, Duty Cycle ≤ 2%.
Unit
mA
V
mA
mA
mA
V
A/ms
V/ms
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