MAX9721 查看數據表（PDF） - Maxim Integrated

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MAX9721

1V, Fixed-Gain, DirectDrive, Stereo Headphone Amplifier with Shutdown

Maxim Integrated 

1V, Fixed-Gain, DirectDrive, Stereo Headphone

Amplifier with Shutdown

Table 1. Suggested Capacitor Manufacturers

SUPPLIER

Taiyo Yuden

TDK

PHONE

800-348-2496

847-803-6100

FAX

847-925-0899

847-390-4405

WEBSITE

www.t-yuden.com

www.component.tdk.com

Power-Supply Bypass Capacitor (C3)

The power-supply bypass capacitor (C3) lowers the

output impedance of the power supply and reduces the

impact of the MAX9721’s charge-pump switching tran-

sients. Bypass VDD to PGND with the same value as

C1. Place C3 as close to VDD as possible.

Layout and Grounding

Proper layout and grounding are essential for optimum

performance. Connect PGND and SGND together at a

single point on the PC board. Connect PVSS to SVSS

and bypass with C2 to PGND. Bypass VDD to PGND

with C3. Place capacitors C2 and C3 as close to the

MAX9721 as possible. Route PGND, and all traces that

carry switching transients, away from SGND and the

audio signal path.

The MAX9721 does not require additional heatsinking.

The thin QFN package features an exposed paddle that

improves thermal efficiency of the package. Ensure

that the exposed paddle is electrically isolated from

GND and VDD. Connect the exposed paddle to VSS if

necessary.

UCSP Applications Information

For the latest application details on UCSP construction,

dimensions, tape carrier information, printed circuit

board techniques, bump-pad layout , and recommend-

ed reflow temperature profile, as well as the latest infor-

mation on reliability testing results, go to Maxim’s

website at www.maxim-ic.com/ucsp for the Application

Note: UCSP—A Wafer-Level Chip-Scale Package.

Chip Information

TRANSISTOR COUNT: 2559

PROCESS: BiCMOS

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